Materials Engineering

Underfill Adhesive Flow and Cure

The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.

Failure Analysis

The consultants at Veryst provide failure and root cause analyses using core engineering disciplines to evaluate different failure scenarios.  Engineering specialties we apply to failure analyses include: mechanical engineering, materials science (metallurgy, ceramics, polymer science, compo

Specialized Tools and Techniques

Veryst Engineering provides a variety of state-of-the-art characterization services, including Digital Image Correlation (DIC), high speed imaging, microscopy, and FTIR spectroscopy and microscopy for our clients.