Join Dr. Nirmal Paudel as he explores the cutting-edge of wireless power transfer technology, enhancing efficiency and reliability across industries like electric vehicles and consumer electronics.
Allyson Hartzell, co-author of the essential book “MEMS Reliability,” discussed some key MEMS issues in a recent interview with Tim Rodgers of Accendo Reliability.
The makers of ADINA software have announced that “in response to customers’ requirements,” ADINA supports the Bergstrom-Boyce and Three-Network viscoelastic material models, saying, “These sophisticated material models allow users to capture complex viscoelastic behaviors of polymeric components.”
Allyson Hartzell has just published a practical guide to “Avoid these common MEMS failure mechanisms” in an article on the EDN Network’s website. The article provides specific and concrete advice for identifying and avoiding failure mechanisms, as well as helpful tips for system developers.
Dr. Alireza Kermani used CFD software to prepare an evaluation of ventilation system design in hospital patient rooms. The study was presented at COMSOL Conference 2015 Boston and was later the subject of a COMSOL blog.
Dr. Sean Teller has joined Veryst Engineering, bringing extensive experience in the mechanical behavior of materials at low and high strain rates, including viscoelasticity, viscoplasticity, nonlinear materials, and fracture mechanics.
Dr. Matthew Hancock presented "Simulations of Micropumps Based on Tilted Flexible Fibers" at the American Physical Society's 68th Annual Division of Fluid Dynamics (DFD) Meeting,
Dr. Stuart Brown coauthored the “Child Resistant Closure Performance Aging Study” and presented this paper at the American Society of Mechanical Engineers International Mechanical Engineering Congress & Exposition.
FluidicMEMS is an informal gathering of people from academia, medicine, industry, and business to meet and explore how microfluidic and BioMEMS technology will impact healthcare, research, and beyond.
Dr. Mark Oliver made presentations on "Testing and Modeling the Mechanical Behavior of Flexible Adhesives" and on "Multiphysics Modeling of Underfill Flow and Cure During Thermocompression Bonding" at two industry conferences.
