News & Events

Rodent Model for Orthotopic Implantation of Engineered Liver Devices

Veryst supports bioengineering study of new surgical technique, just published

January 17, 2023
Veryst is proud to have supported 3D BioLabs LLC with a study described in its recent publication titled “Rodent Model for Orthotopic Implantation of Engineered Liver Devices.” The publication presents a novel surgical technique to provide blood supply to implanted cellularized devices that augment or replace liver tissue function.
Polymer Forming Simulation

Article published on The Art of Accurate Polymer Modelling

October 31, 2016
"Stress-free Simulation: The Art of Accurate Polymer Modelling" is the title of an article by Veryst's Eric Schmitt and Jorgen Bergstrom. The article appears in the October 2016 issue of Benchmark magazine, published by NAFEMS.
MEMS

Tutorial program in MEMS reliability at IIRW

October 9, 2016
MEMS expert Allyson Hartzell presented a Tutorial Program at the IIRW (International Integrated Reliability Workshop), covering a range of topics including tutorial covered common failure mechanisms in MEMS and examples of design and process fixes.
COMSOL Certified Consultant logo

Gold Sponsor of COMSOL Conference 2016

October 5, 2016
Veryst Engineering is proud to have been a Gold Sponsor once again of COMSOL’s premier event, and to have presented four papers at the conference.
Microfluidics

Presentation at Lab-on-a-Chip Conference 2016

September 26, 2016
Dr. Matthew Hancock offered a presentation on "Modeling and Simulation of Microfluidic Organ-on-Chip Devices" at the Lab-on-a-Chip Microfluidics & Microarrays World Congress 2016.
Microfluidics

Webinar on modeling microfluidic devices with COMSOL Multiphysics

July 28, 2016
Dr. Matthew Hancock co-presented a webinar titled "Modeling Microfluidic Devices with COMSOL Multiphysics," which focused on enhancing modeling and design processes for lab-on-a-chip devices, biosensors, micromixers, inkjet nozzles, and other microfluidic systems.
MEMS

MEMS expert appointed to conference board

July 14, 2016
Veryst is pleased to announce that Allyson Hartzell, an expert in MEMS, was approved as a member of the Advanced Packaging Committee for ECTC (the Electronic Components and Technology Conference) 2017.

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